软光刻干膜层压工作站系统,Dry film lamination station

型号:SU-8
联系人:李胜亮
联系电话:18618101725
品牌:darwin

SU-8模具制造站,SU-8厚胶制作系统,,SU-8厚光刻胶制作系统

使用层压工艺快速简单地创建模具

我们在这里提供一种用于干膜光刻胶的层压套件。 您将找到使用轧机制造微流体模具所需的一切。 干膜层压可以很好地控制微结构的高度,您的模具可以在不到一个小时的时间内完成。 它比基于树脂的表亲更清洁,更快速,更便宜。
快速协议(1小时以下)
完美控制结构高度
比树脂基光刻更便宜
干净整洁的过程


优点


  1. 高度可重复的芯片制造工艺
  2. 包括用于PDMS粘合的全自动等离子清洁器
  3. 快速制造工艺,24小时开发芯片
  4. 利用我们对软光刻工艺设备的了解

套装设备:


  1. 完整的空气等离子系统
  2. 用于快速PDMS固化的烤箱
  3. 用于PDMS脱气的干燥器
  4. 要做PDMS膜,可以选择旋涂机。

配件和化学品

所有化学品(PDMS,异丙醇,丙酮等)和所有实验室配件(玻璃载玻片,培养皿,一次性杯子,搅拌棒,手术刀等)都包括在内,以便为您提供最完整的产品。

Chemicals-microfluidic-SU8-developer-isopropanol-aceton-TMCS

售后支持:


标准支持包:我们负责所有仪器的售后服务,我们为您提供微加工工艺表和教程,我们为您提供1年的电话帮助,以解答您可能遇到的任何微加工问题。

扩展支持包:除标准包外,我们的研发团队直接在您的实验室中安装softlithobox,我们根据您的需求调整我们的所有微加工流程,我们培训您的团队,直到准备好制作您的所有微流体芯片。

Our specialists selected and adapted the best instruments to make them work together with reliable process. You can find here a short description of the equipment. Please don’t hesitate to contact us to have more information and keep in mind that we have several model to fit for the best your needs.

ROLLING-MILL

Lamination kit dry film microfabrication microfluidique chipRolling mill machine working with 6 rolls with 4 heating. The speed and the temperature can be adapted according to the application and can be use for thickness up to 3mm. The rolls can move toward and backward and are easily cleanable.

A device adapted for Soft-lithography applications

The wide speed and temperature range offers the possibility to work with different kind of dry film photoresist and even to imagine 3D structures by laminating on pre-design layers. It’s small and easy to use tool perfect to be installed everywhere especially outside a clean room.

 Major strengths:

  • Easy to use
  • Work with any dry film photoresist
  • Wide range of speed (up to 1,3m/min) and temperature (up to 140°C)
  • Digital panel for a perfect control of the parameters
  • Easy to clean

UV LAMP SYSTEM

UV LAMP BLACK photolithography Programmable-UV-lampAn unique UV LED exposure and masking system (in option) with available light sources at wavelengths of 365 nm or 385 nm. This is a very compact table-top system capable of exposing a wafer surface area of up to 4 inches in diameter. This automatic UV system is compatible with hard (physical) or soft (proximity) masking contacts, and features variable mask to substrate distance control.

A device adapted for Soft-lithography applications

With 2μm resolution, the device is particularly well tuned for soft-lithography applications. The exposure in flash enables to reduce the internal mechanical stress of the photoresist. Its little size enables to install it everywhere you want, especially outside a clean room.

 Major strengths:

  • Perfectly monochromatic exposure over the wafer surface area (bandwidth lower than 10 nm)
  • Cold UV exposure
  • Divergence angle of the light < 2°
  • Strong power density
  • Long LED lifetime: more than 10 000 hours equivalent to 8 – 10 years of use
  • User-friendly touch screen interface for exposure cycles programming
  • No warm-up time required
  • Intuitive control of UV source intensity
  • Automated wafer loading and unloading system
  • Usable with glass and plastic photomask
  • High UV uniformity on 4 inches wafer
  • Integrated UV meter

PROGRAMMABLE HOT PLATE

Tutorial SU8 photoresist baking during photolithography process - hot plateEnsure accurate, homogeneous and stable temperature set points. This digital hotplate device enables to set temperature ramp for heating and cooling down. Make your life easier with its programmable controls which enable to automatize your photolithography process.

A device adapted for Soft-lithography applications

Its aluminum top plate and its great heating surface area enables to have a wide enough zone where the temperature is homogeneous for an efficiently bake of photoresist on a 4 inches wafer. The temperature ramp enables to reduce the mechanical stress inside the photoresist layer. The programmable tool enables to do long photoresist bakes without staying in front of the device.

Major strenghts:

  • Temperature ramp to heat up and cool down.
  • High temperature uniformity over 4 inches wafer
  • Microprocessor display maintains consistent temperature
  • Minimal temperature overshoot
  • Automatic timer
  • Smoothed aluminium plate for easy photoresist cleaning